Furnace Processing National Nanofabrication Centre
2020-3-8 · During cooling, however, wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock, Available gases N2,Ar,O2 AndH2. It can used for Annealing Contact Alloying, Rapid Thermal Oxidation (RTO), Rapid Thermal Nitridation (RTN),Densification and Crystallization, Silicidation etc.